This is one I don’t know…
JLC say one component, a tiny LED (1x1 m with 4 pads) has to be soldered within 24 hours of opening package, and if not (which JLC say they cannot guarantee) they have to be baked first, as susceptible to moisture.
I assumed it was the pads and would lead to a dry joint.
JLC are saying it’s not, and some aspect of the component itself! Surely that makes no sense as reflow would bake it anyway and moisture is a risk after soldering, if so.
Are they bullshitting me?
RevK :verified_r: /
npub1gz…cjdp9
2024-03-22 11:12:00
Author Public Key
npub1gzmg2lwnlvej57la2np3dkgzvt530jj0n2xhhp4evepvc9rdx03qtcjdp9Published at
2024-03-22 11:12:00Event JSON
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"content": "This is one I don’t know…\n\nJLC say one component, a tiny LED (1x1 m with 4 pads) has to be soldered within 24 hours of opening package, and if not (which JLC say they cannot guarantee) they have to be baked first, as susceptible to moisture.\n\nI assumed it was the pads and would lead to a dry joint.\n\nJLC are saying it’s not, and some aspect of the component itself! Surely that makes no sense as reflow would bake it anyway and moisture is a risk after soldering, if so.\n\nAre they bullshitting me?",
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