The risk is something different, called "Popcorning".
When moisture in the components boils during reflow, quite violent destruction of the parts can occur.
Drying/baking before reflowing will get rid of the moisture beforehand.
https://www.pcbonline.com/blog/what-is-popcorn-effect-in-pcb-assembly.html
Manawyrm | Sarah /
npub15h…x4xk5
2024-03-22 11:23:34
in reply to nevent1q…nw7v
Author Public Key
npub15h9keklsa8u75d43233hvxe0sxqs9rmr6c2sau55snptxqr420ps3x4xk5Published at
2024-03-22 11:23:34Event JSON
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