Event JSON
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"created_at": 1719924784,
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"content": "Here's the die before final cleaning.\n\nCopper bond wires are challenging to preserve without access to ultra high purity nitric acid (WFNA/RFNA). I've developed some techniques using mixtures of nitric and sulfuric that are decent at preserving some of them, as seen here (70% nitric without any additives would have obliterated all of the wires), but there's still quite a few damaged ones.\n\nI might have had better luck if I etched less long, it looks like the top left etched a lot deeper (to the point of hitting the copper die attach paddle) than the right and bottom. Not sure why that happened.\nhttps://files.ioc.exchange/media_attachments/files/112/716/985/998/164/968/original/ce48f35edd78b727.jpg\n",
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